As a crucial basic material in the manufacturing of multilayer printed circuit boards (PCB), prepreg, despite its relatively thin thickness, demands high standards for surface flatness, mechanical properties, and surface tackiness. Research indicates that tension can affect the average thickness, while tension, vehicle speed, and adhesive viscosity all influence the tackiness of the material. Through DOE experiments to optimize process parameters, the material exhibits excellent surface flatness (with a thickness standard deviation of 0.0071) and an extremely low tacky area ratio (10%) when subjected to a tension of 25 N, a vehicle speed of 13 m/min, and an adhesive viscosity of 410 cps. SEM examination reveals no microcracks in the material, with its tensile strength reaching 10.68 MPa, an increase of over 35%, and its elongation at break reaching 74.1%, an increase of over 33%.